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Amaoe HW4 BGA Reballing stensil, untuk Huawei P8 P9 Lite Honor 4X 4C 5C 5A HI6220 HI6250 MSM8952 CPU alat perbaikan jaring timah tanam

USD 4.50USD 9.00

Amaoe HW4 BGA Reballing stensil, untuk Huawei P8 P9 Lite Honor 4X 4C 5C 5A HI6220 HI6250 MSM8952 CPU alat perbaikan jaring timah tanam

Description
Specification
10pcs W25Q64JVSIQ sopsop8
USD 2.33USD 2.45
RSV STM32F105 LQFP-64
USD 6.16USD 6.92
1 buah/lot LQFP-64 STM32F105
USD 10.62USD 11.80
RSV STM32F105 LQFP-100
USD 6.16USD 6.92
LQFP-64 STM32F105
USD 6.16USD 6.92
RSV STM32F105 LQFP-64
USD 2.31USD 2.60
RSV STM32F105 LQFP-100
USD 6.16USD 6.92
RSV STM32F105 QFP-64
USD 6.84USD 7.69
1-200 Buah
USD 1.49USD 1.58
1-200 Buah
USD 1.49USD 1.58
1-200 Buah
USD 1.49USD 1.58
1-10 buah STM8S207 qqfp80
USD 4.99USD 6.32
STM8S207RBT6 QFP-64
USD 1.78USD 2.00
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