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MI12 stensil BGA untuk Xiaomi 10 10Pro Redmi K30Pro SM8250 CPU PM8250 SDR865 PA POWER IC jaring solder tanam timah

USD 4.50USD 9.00

MI12 stensil BGA untuk Xiaomi 10 10Pro Redmi K30Pro SM8250 CPU PM8250 SDR865 PA POWER IC jaring solder tanam timah

Description
Specification
TDA1552Q TDA1552 ZIP-13
USD 1.88USD 2.14
MP2307DN MP2307 SOP-8
USD 0.20USD 0.23
RTD2668 2668 LQFP-128
USD 1.07USD 1.23
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