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MI13 BGA Reballing Stensil untuk Xiaomi Redmi 9 Note9 CPU PM6350 PM4250 SM7225 MT6769V MT6358VW PM7250B WCN3991 77040 78190 PA IC

USD 4.68USD 5.20

MI13 BGA Reballing Stensil untuk Xiaomi Redmi 9 Note9 CPU PM6350 PM4250 SM7225 MT6769V MT6358VW PM7250B WCN3991 77040 78190 PA IC

Description
Specification
NCEFAT28-08G EMMC BGA153
USD 2.98USD 3.00
XTR115UA SOP XTR115 SOP-8
USD 1.60USD 1.80
PBL3775 3775 DIP-22
USD 1.46USD 1.65
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