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Perlengkapan Motherboard 5D mekanik untuk ponsel 11 Pro MAX 11 Pro XSMax XS X BGA solder Reballing tahan bocor Platform penanaman timah

Category : Alat | Alat Set
USD 54.95USD 84.54

Perlengkapan Motherboard 5D mekanik untuk ponsel 11 Pro MAX 11 Pro XSMax XS X BGA solder Reballing tahan bocor Platform penanaman timah

Description
Specification
Biaya kapal retun
USD 10.00
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