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Qianli BGA Reballing stensil, untuk iPhone 13 12 11 Pro Max XS XR X 8 7 6S 6 IC Chip CPU templat solder tanam timah

Category : Alat | Alat Set
USD 2.95USD 5.90

Qianli BGA Reballing stensil, untuk iPhone 13 12 11 Pro Max XS XR X 8 7 6S 6 IC Chip CPU templat solder tanam timah

Description
Specification
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