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Stensil BGA Reballing Mekanis untuk Chip IC Daya CPU SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR845 HI6423

USD 2.46USD 2.59

Stensil BGA Reballing Mekanis untuk Chip IC Daya CPU SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR845 HI6423

Description

Stensil BGA Reballing mekanis untuk Chip IC daya CPU SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR845 HI6423

Specification

Sertifikasi : NONE

Nama Merek : LANRUISI

Nomor Model : for SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR84

Asal : CN (Asal)

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