Stensil BGA Reballing Mekanis untuk Chip IC Daya CPU SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR845 HI6423
Stensil BGA Reballing mekanis untuk Chip IC daya CPU SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR845 HI6423
Sertifikasi : NONE
Nama Merek : LANRUISI
Nomor Model : for SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR84
Asal : CN (Asal)